AlSiC
AlSiC composites are now one of forward places in the world by the popularity in power electronics systems, microwave and high-power LED lighting systems, because of the reason traditionally used heat-trapping materials (aluminum, copper, etc.) no longer meet the requirements to new power electronics devices due to high CTE, significant weight or cost.
The use of IGBT bases made of a metal matrix composite material (MMCM) based on an aluminum matrix alloy reinforced with a filler – silicon carbide particles, with a high (up to 70 %) SIC content can serve as an effective solution to this problem. Such a material at a low cost of raw materials has a low density, adjustable tclr, high thermal conductivity, strength and hardness. The unique combination of matrix alloy and filler properties allows adjusting the physical properties of the resulting AlSiC MMC by changing the ratio of components.
The use of IGBT's bases made of a metal matrix composite material (MMCM) based on an aluminum matrix alloy reinforced with a filler – silicon carbide particles, with a high (up to 70 vol.%) SiC content can serve as an effective solution to this problem. Such a material at a low cost of raw materials has a low density, adjustable CTE, high thermal conductivity, strength and hardness. The unique combination of matrix alloy and filler properties allows adjusting the physical properties of the resulting MMCM AlSiC by changing the ratio of components.
The main characteristics of the AlSiC material are in the table below
| № | Name of parameter, unit of measurement | Value |
| 1 | Specific density, g / cm3 | from 2.9 to 3.1 |
| 2 | thermal linear expansion factor, α, 10-6 °C-1 | from 6.0 to 8.0 |
| 3 | bending Strength, σi, MPa | not less than 250 |
| 4 | thermal Conductivity, W/m*K | not less than 180 |